Specifications
| Category | Capability | Mass batch | Small Batch | Sample Order |
| Base Material | Normal Tg Value FR-4 | Shengyi S1141 | ||
| High Tg Value, Halogen Free | Shengyi S1165 (Orange-red core board) | |||
| High CTI | Shengyi S1600（CTI≥600V） | |||
| High Tg Value FR-4 | S1000-2, S1000-2M, IT180A | |||
| Ceramic Powder Filled High Frequency Board | Rogers4003, Rogers4350, Arlon25N | |||
| PTFE High Frequency Material: | Rogers, Taconic, Arlon, WANGLING | |||
| PTFE Prepreg | Taconic, TPG, Fastrise | |||
| High Speed (1-5 G) | Tu-862, S7038, S1165, Isola-FR408HR, Isola-FR406, EMC-EM370, IT170GRA | |||
| High Speed (5-10 G) | Tu-872, s7439, N4000-13SI, M4, Tu-863 | |||
| High Speed (10-25 G) | M6, Tu-883 | |||
| High Speed (>25 G) | M7, Tu-993 | |||
| Layers | 1-30 | 1-30 | 1-30 | 1-30 |
| Laser order | 1-4 | 1-3 | 1-3 | 1-4 |
| Delivery Size (mm) | Max Size (mm) | 460*560 | 460*560 | 550*900 |
| Min Size (mm) | 10*10 | 10*10 | 10*10 | |
| Width / Gap | Inner（mil） | 0.5OZ base copper:3/3 | 1.0OZ base copper:4/4 | 2.0OZ base copper:5/6 |
| 3.0OZ base copper:7/9 | 4.0OZ base copper: 8/12 | 5.0OZ base copper: 10/15 | ||
| 6.0OZ base copper: 12/18 | 10 OZ base copper: 18/24 | 12 OZ base copper: 20/28 | ||
| Outer（mil） | 1/3OZ base copper:3/3 | 0.5OZ base copper:4/4 | 1.0OZ base copper:5/5 | |
| 2.0OZ base copper:6/8 | 3.0OZ base copper: 7/10 | 4.0OZ base copper: 8/13 | ||
| 5.0OZ base copper: 10/16 | 6.0OZ base copper: 12/18 | 10 OZ base copper: 18/24 | ||
| 12 OZ base copper: 20/28 | 15 OZ base copper: 24/32 | |||
| Line Width Tolerance | ＞10.0 mil | ±20% | ±1.5mil | ±1.0mil |
| ≤10.0 mil | ±20% | ±1.0mil | ±1.0mil | |
| Copper Thickness | Inner layer（OZ） | 6 | 6 | 6 |
| Out layer（OZ） | 8 | 8 | 8 | |
| Inner double layer | 18/35um、35/70um | 18/35um、35/70um | 18/35um、35/70um、70/105um | |
| Board thickness for resin plug hole | 0.3-4.0mm | 0.3-4.0mm | 0.3-4.0mm | 0.3-4.0mm |
| Board thickness（mm） | 0.1-8 | 0.3-5.0 | 0.3-5.0 | 0.1-8.0 |
| Board Thickness tolerance | ＞1.0 mm | ±10% | ±8% | ±8% |
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |
| Board thickness/drill bit | 10:01:00 | 12:01:00 | 13:01:00 | |
| Contour | Bevel edge | 20-60 degree, ±5degree | 20-60 degree, ±5degree | 20-60 degree, ±5degree |
| Bow and twist | ≤0.75% | ≤0.75% | ≤0.5% |
Drilling & Hole
| Category | Capability | Mass batch | Small Batch | Sample Order |
| Drilling | Min laser （mm） | 3mil | 3mil | 3mil |
| Max laser （mm） | 8mil | 8mil | 8mil | |
| Min CNC（mm） | 0.2 | 0.15 | 0.15 | |
| Max CNC drill bit（mm） | 6.5 | 6.5 | 6.5 | |
| Min Half Hole(mm) | 0.5 | 0.4 | 0.4 | |
| PTH Hole Normall (mm) | ±0.1 | ±0.075 | ±0.075 | |
| PTH Hole Pressing Hole(mm) | ±0.05 | ±0.05 | ±0.05 | |
| Hole Angle (conical) | Width of upper diameter≤6.5mm：800、900、1000、1100； Width of upper diameter≥6.5mm：900； | |||
| Precision of Depth-control Drilling（mm） | ±0.10 | ±0.075 | ±0.05 | |
| Number of blind CNC holes of one side | ≤2 | ≤3 | ≤4 | |
| Minimum via hole spacing (different network, military, medical, automobile )mm | 0.5 | 0.45 | 0.4 | |
| Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm | 0.4 | 0.35 | 0.3 | |
| The minimum hole wall spacing of the over hole (the same network mm) | 0.2 | 0.2 | 0.15 | |
| Minimum hole wall spacing (mm) for device holes | 0.8 | 0.7 | 0.7 | |
| The minimum distance from via hole to the inner copper or line | 0.2 | 0.18 | ≤10L: 0.15 | |
| >10L: 0.18 | ||||
| The min distance from Device hole to inner copper or line | 0.3 | 0.27 | 0.25 | |
| Diameter range of resin plug hole (mm) | 0.1-0.45 | 0.1-0.45 | 0.1-0.7 | |
| Min diameter of back drilling (mm) | 0.5 | 0.5 | 0.2 | |
| Back drill depth accuracy tolerance (mm) | ±0.05 | ±0.03 | ||
| Max Ratio of hole diameter to board thickness | 10:1 | 10:1 | 20:1 | |
| Tapered hole, stepped hole angle and diameter | Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm) | Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm) | Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm) | |
| Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175–6.3mm) | Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175–6.3mm) | Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175–6.3mm) | ||
| Welding Ring(mil) | Via hole | 4（HDI 3mil） | 3.5（HDI 3mil） | 3 |
| Component hole | 8 | 6 | 6 | |
| Final Board Thickness | ＞1.0 mm | ±10% | ±8% | ±8% |
| ≤1.0 mm | ±0.1mm | ±0.1mm | ±0.1mm | |
| CNC | contour tolerance（mm） | ±0.15 | ±0.10 | ±0.10 |
| V-CUT Tolerance of residual thickness(mm) | ±0.15 | ±0.10 | ±0.10 | |
| （mm） | ||||
| Routing slot（mm） | ±0.15 | ±0.10 | ±0.10 | |
| Precision of controlled deep milling（mm） | ±0.15 | ±0.10 | ±0.10 | |
Solder Mask
| Category | Capability | Mass batch | Small Batch | Sample Order |
| Solder Dam (mil) | （solder mask） | 5 | 4 | 4 |
| （hybrid） | 6 | 5 | 5 | |
| Solder Mask Color | Green, Yellow, Black, Blue, Red, White, Matte Green, Matte Black, Orange | |||
| Silkscreen Color | White, Yellow, Black, Orange | |||
Surface Treatment
| Category | Capability | Mass batch | Small Batch | Sample Order |
| Immersion gold | Ni thickness (micro inch) | 118-236 | 118-236 | 118-236 |
| Max gold (uinch) | 3 | 3 | 6 | |
| Hard gold(Au thick) | Gold finger | Angle: 20°, 30°, 45°, 60° | Angle: 20°, 30°, 45°, 60° | Angle: 20°, 30°, 45°, 60° |
| NiPdAu | NI (uinch) | 118-236 | ||
| PA (uinch) | 2-5 | |||
| Au (uinch) | 1-5 | |||
| Graph electric gold | NI (uinch) | 120-400 | ||
| AU (uinch) | 1-3 | |||
| Immersion tin | Tin (um) | 0.8-1.2 | ||
| Immersion Ag | Ag (uinch) | 6-10 | ||
| OSP | thick (um) | 0.2-0.5 | ||
| HAL/HAL LF | BGApad(mm) | ≥0.3×0.3 | ||
| thickness （mm） | 0.6≤H≤3.0 | |||
| Board thickness vs hole diameter | Press hole≤3:1 | |||
| Tin（um） | 2.0-40.0 | |||
| Other | Soft gold, Immersion gold+OSP, HAS+Gold finger, Immersion gold+gold finger, Water gold+Selective hard gold, OSP+Gold finger | |||
Special Technique
| Category | Capability | Mass batch | Small Batch | Sample Order |
| Special Technique | Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination | Buried magnetic core PCB | Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |
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